The chip level packaging LEDs (csp LEDs) undertaken by Shenzhen Avenue Semiconductor Co., Ltd. recently passed the project acceptance organized by the Shenzhen Science and Technology Innovation Commission. The project undertaking unit has fully completed all the technical research objectives and research content specified in the project contract, achieved fruitful technical achievements and industrialized product series, completed the investment plan required by the supporting requirements, generated corresponding intellectual property rights, and achieved significant economic and social benefits.